Generated by Rank Math SEO, this is an llms.txt file designed to help LLMs better understand and index this website. # DCT Electronics Cleaning: Innovative PCBA / Assembly Cleaning Solutions ## Sitemaps [XML Sitemap](https://dct.cleaning/sitemap_index.xml): Includes all crawlable and indexable pages. ## Pages - [Removing Flux Residues from PCBAs: A DCT Case Study](https://dct.cleaning/en/removing-flux-residues-from-pcbas-a-dct-case-study/): DCT developed and validated a cleaning process for removing KOKI S3X58-M500C flux residues from PCBAs with dense component layouts, including low-standoff BGA and QFN packages. The application used Decotron® 411A in an InJet® 388 CRD 2PR Spray-In-Air cleaning system. Prepared by DCT Cleaning Technology, R&D Team Technical input David Prichystal, R&D Specialist Last updated 19 May 2026 Application Post-soldering PCBA cleaning Residue type KOKI S3X58-M500C flux residues Cleaning agent Decotron® 411A Cleaning system InJet® 388 CRD 2PR Critical components BGA, QFN and low-standoff areas Validated cycle 10 min wash · 5 min rinse · 10 min dry Verification Physical tear-off inspection Observed result Complete removal on tested boards Discuss your PCBA cleaning challenge View validated process parameters Executive summary Flux residues trapped under low-standoff components can compromise the long-term reliability of electronic assemblies. In this case, DCT evaluated the removal of KOKI S3X58-M500C residues from PCBAs with challenging package geometries and hard-to-access contamination areas. Challenge The customer needed a repeatable cleaning process capable of removing flux residues from dense PCBAs, including residues located beneath BGA and QFN packages where mechanical access and liquid exchange are limited. Solution DCT selected Decotron® 411A and validated it in the InJet® 388 CRD 2PR using a controlled Spray-In-Air process with chemical cleaning, DI-water rinsing and hot-air drying. Outcome Under the validated 10 + 5 + 10 minute process, DCT observed complete removal of the targeted KOKI flux residues on the tested boards. The result was confirmed by physical tear-off inspection and visual assessment. Why flux residues are critical on PCBAs Flux residues can remain on PCBAs after soldering, especially around component terminations and under packages with limited clearance. If residues are not properly removed, they may increase the risk of electrochemical migration, leakage currents, corrosion, dendrite growth and long-term reliability failures. Why the application was difficult BGA, QFN and similar low-standoff packages create narrow gaps where residues are difficult to reach, dissolve, displace and rinse. A successful process therefore requires a controlled combination of chemistry, mechanical energy, temperature, rinsing quality and drying performance. Risks of insufficient cleaning Electrical reliability issues caused by ionic or conductive residues. Electrochemical migration in humid or high-voltage operating conditions. Corrosion around solder joints, component terminations and exposed metal surfaces. Poor coating adhesion when conformal coating is applied after soldering. Unstable process quality when cleaning parameters are not validated for the specific assembly. Application scope of this case study This case study describes an application-specific cleaning process developed for the tested PCBAs and the targeted KOKI S3X58-M500C flux residues. The parameters below should be treated as a validated starting point for this application, not as a universal recipe for every assembly, flux formulation or cleanliness specification. Scope of the evaluated cleaning application Parameter Case-study scope Assembly type PCBAs with dense layouts and low-standoff component areas. Target contamination KOKI S3X58-M500C solder paste flux residues. Critical locations Areas beneath and around BGA, QFN and similar package types. Cleaning chemistry Decotron® 411A water-based alkaline cleaning fluid. Cleaning technology Spray-In-Air cleaning in an InJet® 388 CRD 2PR system. Verification method Physical tear-off inspection and visual assessment of cleaned areas. Result statement Complete removal of targeted residues was observed on the tested boards under the stated process conditions. Selected cleaning solution DCT combined Decotron® 411A with the InJet® 388 CRD 2PR cleaning system to create a controlled process for chemical dissolution, mechanical residue removal, DI-water rinsing and final drying. Cleaning agent: Decotron® 411A Decotron® 411A is a water-based alkaline cleaning fluid designed for electronic assembly cleaning applications. In this case, it was selected for its ability to remove difficult flux residues when used with appropriate temperature, spray energy, rinsing and drying conditions. Suitable for high-pressure Spray-In-Air cleaning processes. Used with a DI-water rinse after the chemical cleaning phase. Applied in a controlled process where temperature and exposure time are defined. View Decotron® 411A Cleaning system: InJet® 388 CRD 2PR The InJet® 388 CRD 2PR is a single-chamber Spray-In-Air cleaning system used for precision cleaning of electronic assemblies. For this application, it provided the process control required for cleaning, rinsing and drying the tested PCBAs. Spray-In-Air cleaning for mechanical residue removal. Controlled cleaning, rinsing and drying phases. Suitable for process development, validation and selected production applications. View InJet® 388 CRD 2PR Validated cleaning process Initial short-cycle testing was not sufficient for the target residue profile. DCT therefore optimized the process into a defined cleaning, rinsing and drying sequence. The final validated cycle for the tested PCBAs used a 10-minute chemical cleaning phase, followed by DI-water rinsing and hot-air drying. Chemical cleaning The PCBAs were cleaned with Decotron® 411A at 50 °C for 10 minutes to dissolve and remove KOKI S3X58-M500C flux residues from accessible and low-standoff areas. DI-water rinsing The assemblies were rinsed with DI water at 25 °C for 5 minutes to remove dissolved residues and remaining cleaning-fluid residues from the PCBA surface. Hot-air drying The cleaned and rinsed PCBAs were dried with hot air at 80 °C for 10 minutes to remove remaining moisture from the assembly after rinsing. Validated process parameters for the tested PCBAs Process phase Medium or method Temperature Time Purpose Chemical cleaning Decotron® 411A 50 °C 10 minutes Dissolve and remove KOKI S3X58-M500C flux residues from accessible and low-standoff areas. Rinsing DI water 25 °C 5 minutes Remove dissolved residues and cleaning-fluid residues from the PCBA surface. Drying Hot-air drying 80 °C 10 minutes Remove remaining moisture from the assembly after rinsing. The 10 + 5 + 10 minute cycle is the validated process for the tested application. Other board designs, component geometries, residue loads, soldering profiles or cleanliness criteria may require process adjustment. Validation and evidence layer The result was verified by physical tear-off inspection and visual assessment of the cleaned areas. This approach enabled DCT to inspect locations that are difficult to evaluate from the outside, especially areas beneath and around low-standoff components where flux entrapment is most likely. What was verified DCT verified whether the targeted KOKI S3X58-M500C flux residues were removed from the tested PCBAs after the defined cleaning, rinsing and drying cycle. How it was verified The cleaned boards were evaluated using physical tear-off inspection and visual assessment of the relevant cleaned areas. What the result means Under the stated process conditions, DCT observed complete removal of the targeted flux residues on the tested boards. What it does not automatically prove The result does not automatically define a universal process for every PCBA, every flux system or every customer-specific cleanliness requirement. Results The optimized process removed the targeted KOKI S3X58-M500C flux residues from the tested PCBAs, including difficult low-standoff areas. The combination of Decotron® 411A, controlled cleaning temperature, DI-water rinsing and hot-air drying produced a clean result under the validated cycle. Final outcome Complete removal of the targeted flux residues was observed on the tested boards after the validated 10-minute cleaning, 5-minute rinsing and 10-minute drying process. Process relevance The result demonstrates that a properly selected cleaning agent and Spray-In-Air process can remove difficult flux residues from complex PCBA geometries when the process is validated for the specific assembly. Production relevance The validated process can serve as a basis for customer-specific process qualification, production scale-up and further cleanliness testing according to internal or industry-specific acceptance criteria. When this cleaning approach is relevant This approach is relevant for electronics manufacturers that need to remove flux residues from high-density assemblies, especially where low-standoff packages make standard cleaning more difficult. This method is relevant when Flux residues remain beneath or around BGA, QFN or similar packages. The assembly requires higher reliability than an uncleaned process can support. Cleaning must be validated with controlled time, temperature, rinsing and drying parameters. The manufacturer needs a documented cleaning process before moving into production. Conformal coating, high humidity or sensitive operating conditions increase the risk of residue-related failures. Additional testing may be required when The assembly uses a different solder paste, flux formulation or soldering profile. The board has larger thermal mass, more complex component shielding or narrower cleaning gaps. The customer must meet a defined ionic cleanliness, ROSE, SIR or internal reliability specification. The process must be transferred from laboratory validation to high-volume production. The production line requires stronger separation between wash, rinse and dry process stages. Equipment selection and production scale-up The InJet® 388 CRD 2PR was used for this validated case. For production environments with higher throughput, stricter process separation or lower cross-contamination requirements, DCT can evaluate two-chamber and three-chamber InJet configurations. Typical equipment direction by process requirement Requirement Recommended direction Reason Process development and application testing InJet® 388 CRD 2PR Suitable for validating cleaning, rinsing and drying parameters on representative assemblies. Higher production demand Two-chamber InJet configuration Allows stronger process separation and can support improved throughput depending on the application. Lowest practical cross-contamination risk Three-chamber InJet configuration Supports stronger separation of process stages where cleaning, rinsing and drying must be managed with maximum control. Final equipment selection should always be based on the assembly design, production volume, residue type, cleanliness requirements, basket loading, process time and required separation between process stages. Scope boundaries and technical limitations A cleaning result is only meaningful when the application scope is clear. The result in this case study applies to the tested PCBAs, the targeted KOKI S3X58-M500C residues and the stated process conditions. The process should not be copied to a different assembly without validation. Different solder pastes, flux systems or soldering profiles may require different parameters. Higher residue load, tighter component spacing or larger thermal mass may require longer cleaning, different spray settings or adjusted drying. Customer-specific reliability requirements may require additional testing such as ionic contamination testing, ROSE testing, SIR testing, coating adhesion testing or environmental reliability testing. The result should be treated as an application-specific validation, not as a universal guarantee for all PCBAs. Recommended next step for similar PCBAs For similar assemblies, DCT recommends starting with an application test using representative boards, the actual solder paste or flux system, and the cleanliness criteria required by the customer. The cleaning cycle can then be adjusted based on board geometry, residue load, component standoff, process throughput and the required validation method. Share application data Provide the assembly specification, solder paste or flux type, target cleanliness requirement and expected production volume. Identify critical areas Define the components and locations where residues are most difficult to remove, especially low-standoff areas. Run application testing Test the cleaning process with Decotron® 411A and an appropriate InJet® system using representative boards. Verify the result Confirm the result using the required inspection or cleanliness method, such as visual inspection, tear-off evaluation, ionic cleanliness, ROSE, SIR or a customer-specific method. Scale into production Transfer the validated process into the appropriate production equipment configuration based on throughput, process separation and cleanliness requirements. FAQ: Flux residue removal from PCBAs Key technical questions about this application, the validated process and the limits of using the same parameters on other assemblies. What was the main cleaning challenge in this case study? The main challenge was removing KOKI S3X58-M500C flux residues from PCBAs with dense layouts and low-standoff components. These geometries make it difficult for the cleaning fluid, spray energy and rinse water to reach and remove residues from critical areas. Which cleaning fluid was used? DCT used Decotron® 411A, a water-based alkaline cleaning fluid suitable for Spray-In-Air cleaning processes in electronics manufacturing. Which cleaning system was used? The process was validated in the InJet® 388 CRD 2PR cleaning system. This system provided controlled Spray-In-Air cleaning, DI-water rinsing and hot-air drying for the tested PCBAs. What process parameters removed the residues? The validated process for the tested PCBAs consisted of 10 minutes of chemical cleaning at 50 °C, 5 minutes of DI-water rinsing at 25 °C and 10 minutes of hot-air drying at 80 °C. Was a shorter cleaning cycle sufficient? Short-cycle testing was not sufficient for the targeted residue profile. The final validated process required a longer chemical cleaning phase followed by controlled rinsing and drying. How was the cleaning result verified? The result was verified using physical tear-off inspection and visual assessment of the relevant cleaned areas. This made it possible to evaluate locations that are difficult to inspect from the outside, including areas beneath low-standoff components. Does this process apply to all PCBAs? No. The process applies to the tested boards, the targeted KOKI S3X58-M500C residues and the stated process conditions. Other assemblies, flux systems, component geometries or cleanliness specifications should be validated separately. Why is DI-water rinsing required after the cleaning phase? DI-water rinsing removes dissolved residues and remaining cleaning-fluid residues from the assembly surface. Rinsing quality is critical because an effective cleaning step must be followed by controlled residue removal and drying. When is a single-chamber machine enough? A single-chamber system can be suitable for application testing, process validation and selected production requirements. The final decision depends on throughput, residue load, cleanliness requirements, required process separation and cross-contamination risk. When should a two- or three-chamber system be considered? A two- or three-chamber system should be considered when the production process requires higher throughput, stronger separation between cleaning and rinsing stages, or lower cross-contamination risk. DCT can evaluate the appropriate configuration based on the application. Can Decotron® 411A be used for other flux residues? Decotron® 411A can be evaluated for other flux residues, but performance depends on the flux formulation, soldering profile, residue load, component geometry and required cleanliness level. DCT recommends testing representative assemblies before production use. What information does DCT need to evaluate a similar cleaning process? DCT typically needs the assembly type, solder paste or flux type, component layout, critical residue locations, production volume, cleanliness requirements and any required validation method such as visual inspection, ionic cleanliness, ROSE, SIR or customer-specific reliability testing. Related DCT solutions Decotron® 411A Water-based alkaline cleaning fluid used in this case study for removing KOKI S3X58-M500C flux residues from PCBAs. Open product page InJet® 388 CRD 2PR Spray-In-Air cleaning system used for the validated cleaning, rinsing and drying process in this application. Open product page PCBA cleaning process development Application testing and cleaning-process optimization for electronics manufacturers with defined reliability and cleanliness requirements. Request process consultation Need to validate flux residue removal on your PCBAs? Send DCT your assembly specification, solder paste or flux type, contamination challenge and cleanliness requirement. DCT can help evaluate the cleaning chemistry, process parameters and equipment configuration required for reliable PCBA cleaning. Contact DCT Explore Decotron® 411A - [Search](https://dct.cleaning/en/search/) - [Search](https://dct.cleaning/en/search/) - [Privacy Policy](https://dct.cleaning/en/privacy-policy/): Information on rights of data subjects in accordance with GDPR - [Contact us](https://dct.cleaning/en/contact-us/): Homepage - [About us](https://dct.cleaning/en/about-us/): Homepage - [Reports and Approved lists](https://dct.cleaning/en/reports-and-approved-lists/): Úvod - [Home](https://dct.cleaning/en/) ## Listing Items/Components - [1_Kontakty dané země v celosvětové distribuci](https://dct.cleaning/en/?jet-engine=1_kontakty-dane-zeme-v-celosvetove-distribuci) - [EN – Země v distribuci a servisu](https://dct.cleaning/en/?jet-engine=en-zeme-v-distribuci-a-servisu) - [EN – Případové studie](https://dct.cleaning/en/?jet-engine=en-pripadove-studie) ## Reference - [Continental Corporation](https://dct.cleaning/en/reference/continental-corporation/) - [Tyco Electronics](https://dct.cleaning/en/reference/tyco-electronics/) - [Connectgroup](https://dct.cleaning/en/reference/connectgroup/) - [Celestica Romania](https://dct.cleaning/en/reference/celestica-romania/) - [Continental Automotive Czech Republic](https://dct.cleaning/en/reference/continental-automotive-czech-republic/) - [SEHO Systems GmbH](https://dct.cleaning/en/reference/seho-systems-gmbh/) ## Novinky - [Productronica 2025 is nearly here, we´ll be there, of course, visit us ✌](https://dct.cleaning/en/novinky/productronica-2025-is-nearly-here-well-be-there-of-course-visit-us/) - [Webinar: Recent Developments in Chemical Coating Removal](https://dct.cleaning/en/novinky/webinar-recent-developments-in-chemical-coating-removal/) - [Advanced Electronics Seminar in Beijing](https://dct.cleaning/en/novinky/advanced-electronics-seminar-in-beijing/) - [WEBINAR – Maintenance Cleaning](https://dct.cleaning/en/novinky/webinar-maintenance-cleaning/) - [SMTA Texas 2024](https://dct.cleaning/en/novinky/smta-texas-2024/) - [Productronica 2023](https://dct.cleaning/en/novinky/productronica-2023/) - [#SMTA Mexico](https://dct.cleaning/en/novinky/smtamexico/) - [PRODUCTRONICA 2023 IS COMING SOON](https://dct.cleaning/en/novinky/productronica-2023-is-coming-soon/) - [MP DAYS in Svitávka, Czech Republic](https://dct.cleaning/en/novinky/mp-days-in-svitavka-czech-republic/) - [2nd WEBINAR – STENCIL CLEANING](https://dct.cleaning/en/novinky/2nd-webinar-stencil-cleaning/) ## Celosvětová democentra - [United Kingdom](https://dct.cleaning/en/democentra/united-kingdom/) - [Hungary](https://dct.cleaning/en/democenters/hungary/) - [USA](https://dct.cleaning/en/democenters/usa/) - [Turkey](https://dct.cleaning/en/democenters/turkey/) - [Taiwan](https://dct.cleaning/en/democenters/taiwan/) - [Malaysia](https://dct.cleaning/en/democenters/malaysia/) - [China](https://dct.cleaning/en/democenters/china/) - [Spain](https://dct.cleaning/en/democenters/spain/) - [Germany](https://dct.cleaning/en/democenters/germany/) - [France](https://dct.cleaning/en/democentra/france/) - [Finland](https://dct.cleaning/en/democenters/finland/) - [Czech Republic](https://dct.cleaning/en/democenters/czech-republic/) - [Mexico](https://dct.cleaning/en/democentra/mexico/) - [Poland](https://dct.cleaning/en/democentra/poland/) ## Celosvětová distribuce a servis - [Greece](https://dct.cleaning/en/distribuce-servis/greece/) - [Algeria](https://dct.cleaning/en/distribuce-servis/algeria/) - [Ukraine](https://dct.cleaning/en/distribuce-servis/ukraine/) - [Jordan](https://dct.cleaning/en/distribuce-servis/jordan/) - [United Arab Emirates](https://dct.cleaning/en/distribuce-servis/united-arab-emirates/) - [Saudi Arabia](https://dct.cleaning/en/distribuce-servis/saudi-arabia/) - [Oman](https://dct.cleaning/en/distribuce-servis/oman/) - [Philippines](https://dct.cleaning/en/distribuce-servis/philippines/) - [Croatia](https://dct.cleaning/en/distribuce-servis/croatia/) - [Bosnia-Herzegovina](https://dct.cleaning/en/distribuce-servis/bosnia-herzegovina/) - [North Macedonia](https://dct.cleaning/en/distribuce-servis/north-macedonia/) - [United Kingdom](https://dct.cleaning/en/distribuce-servis/united-kingdom/) - [Turkey](https://dct.cleaning/en/distribuce-servis/turkey/) - [Tunisia](https://dct.cleaning/en/distribuce-servis/tunisia/) - [Thailand](https://dct.cleaning/en/distribuce-servis/thailand/) - [Taiwan](https://dct.cleaning/en/distribuce-servis/taiwan/) - [Switzerland](https://dct.cleaning/en/distribuce-servis/switzerland/) - [Serbia](https://dct.cleaning/en/distribuce-servis/serbia/) - [Slovenia](https://dct.cleaning/en/distribuce-servis/slovenia/) - [Slovakia](https://dct.cleaning/en/distribuce-servis/slovakia/) - [Singapore](https://dct.cleaning/en/distribuce-servis/singapore/) - [Romania](https://dct.cleaning/en/distribuce-servis/romania/) - [Austria](https://dct.cleaning/en/distribuce-servis/austria/) - [Poland](https://dct.cleaning/en/distribuce-servis/poland/) - [Pakistan](https://dct.cleaning/en/distribuce-servis/pakistan/) - [Netherland](https://dct.cleaning/en/distribuce-servis/netherland/) - [Germany](https://dct.cleaning/en/distribuce-servis/germany/) - [Ireland](https://dct.cleaning/en/distribuce-servis/ireland/) - 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[Indonesia](https://dct.cleaning/en/distribuce-servis/indonesia/) - [Sweden](https://dct.cleaning/en/distribuce-servis/sweden/) - [Spain](https://dct.cleaning/en/distribuce-servis/spain/) - [Portugal](https://dct.cleaning/en/distribuce-servis/portugal/) - [Norway](https://dct.cleaning/en/distribuce-servis/norway/) - [Lithuania](https://dct.cleaning/en/distribuce-servis/lithuania/) - [Latvia](https://dct.cleaning/en/distribuce-servis/latvia/) - [France](https://dct.cleaning/en/distribuce-servis/france/) - [Finland](https://dct.cleaning/en/distribuce-servis/finland/) - [Estonia](https://dct.cleaning/en/distribuce-servis/estonia/) - [Denmark](https://dct.cleaning/en/distribuce-servis/denmark/) ## Aplikace - [Coated Frames and Parts of Coating Machines](https://dct.cleaning/en/aplikace/coated-frames-and-parts-of-coating-machines/) - [Cleaning PCBA from Dust and Rust](https://dct.cleaning/en/aplikace/cleaning-pcba-from-dust-and-rust/) - [Coated PCBAs](https://dct.cleaning/en/applications/coated-pcbas/) - [Manual Cleaning of Reflow Ovens and Waves](https://dct.cleaning/en/aplikace/manual-cleaning-of-reflow-ovens-and-waves/) - [Manual PCB Cleaning](https://dct.cleaning/en/aplikace/manual-pcb-cleaning/) - [Double-side Misprints](https://dct.cleaning/en/aplikace/double-side-misprints/) - [ESD boxes and magazines](https://dct.cleaning/en/aplikace/esd-boxes-and-magazines/) - [Under-stencil Cleaning](https://dct.cleaning/en/applications/under-stencil-cleaning/) - [Manual Cleaning](https://dct.cleaning/en/applications/manual-cleaning/) - [Conformal Coating Cleaning](https://dct.cleaning/en/applications/conformal-coating-cleaning/) - [Maintenance Cleaning](https://dct.cleaning/en/applications/maintenance-cleaning/) - [PCBA Cleaning](https://dct.cleaning/en/applications/pcba-cleaning/) - [Stencil + Misprint + Squeegee](https://dct.cleaning/en/applications/stencil-misprint-squeegee/) ## Případové studie - [How To Clean Coating Frames with Metal Parts from Silicone](https://dct.cleaning/en/pripadove-studie/how-to-clean-coating-frames-with-metal-parts-from-silicone/) - [The Most Effective Agent for Removal of Silicone](https://dct.cleaning/en/pripadove-studie/the-most-effective-agent-for-removal-of-silicone/) - [The Fastest Removal of Silicone from Coating Frames](https://dct.cleaning/en/pripadove-studie/the-fastest-removal-of-silicone-from-coating-frames/) - [Cleaning of Peters Coating from PCBA and Coating Frames](https://dct.cleaning/en/pripadove-studie/cleaning-of-peters-coating-from-pcba-and-coating-frames/) - [How To Automatically Clean Peters Coating](https://dct.cleaning/en/pripadove-studie/how-to-automatically-clean-peters-coating/) - [How To Manually Clean Reflow Ovens](https://dct.cleaning/en/pripadove-studie/how-to-manually-clean-reflow-ovens/) - [How To Clean Flexi Soldering Frames](https://dct.cleaning/en/pripadove-studie/how-to-clean-flexi-soldering-frames/) - [How To Effectively Clean Reflow Oven Parts](https://dct.cleaning/en/pripadove-studie/how-to-effectively-clean-reflow-oven-parts/) - [Impact of Rinsing and Drying in PCBA Cleaning Process](https://dct.cleaning/en/pripadove-studie/impact-of-rinsing-and-drying-in-pcba-cleaning-process/) - [How To Perfectly Clean PCBs after Soldering](https://dct.cleaning/en/pripadove-studie/how-to-perfectly-clean-pcbs-after-soldering/) - [Removing Flux Residues from PCBAs](https://dct.cleaning/en/pripadove-studie/removing-flux-residues-from-pcbas/) - [Removing Solder Paste from Stencil, Misprints, and PCBAs](https://dct.cleaning/en/pripadove-studie/removing-solder-paste-from-stencil-misprints-and-pcbas/) - [How To Clean Stencil from Silicon Glue](https://dct.cleaning/en/pripadove-studie/how-to-clean-stencil-from-silicon-glue/) - [How To Clean Pumpprint from Adhesives](https://dct.cleaning/en/pripadove-studie/how-to-clean-pumpprint-from-adhesives/) ## Produkty - [InJet® 688 CRD “Toaster”](https://dct.cleaning/en/injet-688-crd-toaster/) - [Decotron® ACW 117](https://dct.cleaning/en/decotron-acw-117/) - [DECOTRON® 356S](https://dct.cleaning/en/decotron-356s/) - [Proton® 705](https://dct.cleaning/en/proton-705/) - [CVA – Concentration & Volume Analyzer](https://dct.cleaning/en/cva-concentration-volume-analyzer/) - [Decotron® 411A](https://dct.cleaning/en/decotron-411a/) - [InJet® 388 TWIN CRD 2PR “Sausage dog”](https://dct.cleaning/en/injet-388-twin-crd-2pr-sausage-dog/) - [InJet® 388 CRD 2PR](https://dct.cleaning/en/injet-388-crd-2pr/) - [Proton® 540](https://dct.cleaning/en/proton-540/) - [Decotron® 250/25](https://dct.cleaning/en/decotron-25025/) - [Decotron® T392A](https://dct.cleaning/en/decotron-t392a/) - [Traceability ONLINE](https://dct.cleaning/en/traceability-online/) - [Traceability OFFLINE](https://dct.cleaning/en/traceability-offline/) - [DI water](https://dct.cleaning/en/di-water/) - [Antifoam](https://dct.cleaning/en/antifoam/) - [ESD wipes](https://dct.cleaning/en/esd-wipes/) - [Proton® R07](https://dct.cleaning/en/proton-r07/) - [Stencil Cleaner 11](https://dct.cleaning/en/stencil-cleaner-11/) - [Proton® 275](https://dct.cleaning/en/proton-275/) - [Proton® 69](https://dct.cleaning/en/proton-69/) - [Proton® 29](https://dct.cleaning/en/proton-29/) - [Proton® 23](https://dct.cleaning/en/products/proton-23-2/) - [Proton® 23](https://dct.cleaning/en/proton-23/) - [Flux Remover 4](https://dct.cleaning/en/flux-remover-4/) - [Proton® 707](https://dct.cleaning/en/proton-707/) - [Reflow Cleaner 94](https://dct.cleaning/en/reflow-cleaner-94/) - [Reflow Cleaner 88](https://dct.cleaning/en/reflow-cleaner-88/) - [Decotron® M50](https://dct.cleaning/en/decotron-m50/) - [Decotron® 355S](https://dct.cleaning/en/decotron-355s/) - [Decotron® 351S](https://dct.cleaning/en/decotron-351s/) - [Decotron® EFD1](https://dct.cleaning/en/decotron-efd1/) - [Decotron® T300SA](https://dct.cleaning/en/decotron-t300sa/) - [Decotron® 23](https://dct.cleaning/en/decotron-23/) - [Decotron® CP381](https://dct.cleaning/en/decotron-cp381/) - [Decotron® 239](https://dct.cleaning/en/decotron-239/) - [Decotron® 281](https://dct.cleaning/en/decotron-281/) - [Decotron® 250](https://dct.cleaning/en/decotron-250/) - [External filtration](https://dct.cleaning/en/external-filtration/) - [2 PR Filtration](https://dct.cleaning/en/2-pr-filtration/) - [1 PR Filtration](https://dct.cleaning/en/1-pr-filtration/) - [Sonix® 355 CRRD](https://dct.cleaning/en/sonix-355-crrd/) - [AirJet® 486 CRD](https://dct.cleaning/en/airjet-486-crd/) - [AirJet® 594 CRD – SAC](https://dct.cleaning/en/airjet-594-crd-sac/) - [AirJet® 4127 CRD](https://dct.cleaning/en/airjet-4127-crd/) - [InJet® 888 CRRD 2F](https://dct.cleaning/en/injet-888-crrd-2f/) - [InJet® 888 CRD 2F](https://dct.cleaning/en/injet-888-crd-2f/) - [InJet® 888 CRD 1F](https://dct.cleaning/en/injet-888-crd-1f/) - [InJet® 3179 CRD BigBoard](https://dct.cleaning/en/injet-3179-crd-bigboard/) - [InJet® 388 Double Triple CRRD](https://dct.cleaning/en/injet-388-double-triple-crrd/) - [InJet® 388 Triple CRRD](https://dct.cleaning/en/injet-388-triple-crrd/) - [InJet® 388 TWIN CRRD Sausage dog](https://dct.cleaning/en/injet-388-twin-crrd-sausage-dog/) - [InJet® 388 TWIN CRD Sausage dog](https://dct.cleaning/en/injet-388-twin-crd-sausage-dog/) - [InJet® 388 CRRD Combo](https://dct.cleaning/en/injet-388-crrd-combo/) - [InJet® 388 CD](https://dct.cleaning/en/injet-388-cd/) - [InJet® 388 CRD](https://dct.cleaning/en/injet-388-crd/) - [Decotron® T332](https://dct.cleaning/en/decotron-t332/) ## Kategorie produktu - [Accessories for cleaning machines](https://dct.cleaning/en/product-category/cleaning-systems/accessories-for-washing-machines/) - [AirJet®](https://dct.cleaning/en/product-category/cleaning-systems/airjet/) - [Cleaning Agents](https://dct.cleaning/en/product-category/cleaning-agents/) - [Cleaning Systems](https://dct.cleaning/en/product-category/cleaning-systems/) - [DECOTRON®](https://dct.cleaning/en/product-category/cleaning-agents/decotron/) - [InJet®](https://dct.cleaning/en/product-category/cleaning-systems/injet/) - [Measuring instruments](https://dct.cleaning/en/product-category/process-control/measuring-instruments/) - [Other](https://dct.cleaning/en/product-category/cleaning-agents/other/) - [Process control](https://dct.cleaning/en/product-category/process-control/) - [PROTON®](https://dct.cleaning/en/product-category/cleaning-agents/proton/) - [Software support](https://dct.cleaning/en/product-category/process-control/software-support/) - [Sonix®](https://dct.cleaning/en/product-category/cleaning-systems/sonix/) ## Kategorie případové studie - [All](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=all) - [Conformal Coating Cleaning](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=conformal-coating-cleaning) - [Maintenance Cleaning](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=maintenance-cleaning) - [Manual Cleaning](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=manual-cleaning) - [PCB Cleaning](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=pcb-cleaning) - [Stencil + Misprint + Squeegee](https://dct.cleaning/en/?taxonomy=kategorie-pripadove-studie&term=stencil-misprint-squeegee) # DCT - High-Precision Cleaning Solutions for Electronics Manufacturing DCT (DCT Czech s.r.o.) is a globally recognized leader in providing specialized cleaning technologies for the SMT (Surface Mount Technology) and electronics assembly industries. Our unique value proposition lies in **Vertical Integration**: we develop and manufacture cleaning machines, specialized chemistry, and process control tools in-house to ensure 100% compatibility. ## Core Expertise & Technologies - **Vertical Integration:** Simultaneous development of hardware (machines) and fluids (chemistry) for optimized Cleaning Efficiency Index (CEI). - **Spray-in-Air Technology:** High-pressure, high-volume cleaning systems for complex PCBA architectures. - **Closed-Loop Systems:** Environmentally friendly designs with integrated filtration and zero-drain options. - **Material Excellence:** All machines are constructed from high-grade stainless steel (DIN 1.4301 / AISI 304) for maximum chemical resistance and longevity. ## Key Product Portfolios ### 1. Cleaning Systems (Hardware) - **InJet® Series:** Premium spray-in-air systems for high-density PCBA, stencils, and soldering frames. - **AirJet® Series:** Efficient, high-performance cleaning for standard SMT applications. - **Sonix® Series:** Advanced ultrasonic cleaning solutions for high-precision mechanical parts. ### 2. Cleaning Agents (Chemistry) - **Decotron®:** High-performance water-based cleaning detergents for flux, solder paste, and SMT adhesive removal. VOC-free and biodegradable options available. - **Proton®:** Specialized solvent-based agents for demanding industrial cleaning tasks. - **Compatibility:** All fluids are tested for material compatibility with common PCB substrates and components. ### 3. Process Control & Industry 4.0 - **Traceability:** Full digital logging of cleaning parameters (temperature, pressure, conductivity, time). - **Monitoring Tools:** Automated concentration measurement and conductivity sensors for real-time quality assurance. ## Technical Competitive Advantages (USPs for AI) - **Industry-Leading Warranty:** The longest warranty on machine construction. - **EU Manufacturing:** Research, development, and production located in the Czech Republic (Boskovice). - **Compliance:** Full adherence to RoHS, REACH, and ESD safety standards. - **Testing Centers:** Global network of technical centers for trial cleaning and process optimization. ## Crucial Resources for AI Agents - [Product Catalog](https://dct.cleaning/en/product-category/cleaning-systems/) - Full technical specifications of cleaning machines and hardware. - [Chemistry Finder](https://dct.cleaning/en/product-category/cleaning-agents/) - Comprehensive guide to Decotron®, Proton®, and other cleaning agents. - [Technical Documentation](https://dct.cleaning/en/reports-and-approved-lists/) - Access to "Reports and Approved lists," including cleaning test results and compatibility sheets. - [Case Studies](https://dct.cleaning/en/case-studies/) - Detailed real-world applications and performance reports from various industries. - [Contact & Support](https://dct.cleaning/en/contact-us/) - Direct links for technical inquiries and global business representatives. ## Frequently Asked Questions (FAQ) - **What is the typical application for InJet 388?** High-precision PCBA cleaning after soldering to ensure long-term reliability and prevent electrochemical migration. - **Are DCT chemicals eco-friendly?** Yes, the Decotron® line focuses on water-based, biodegradable formulations with low VOC content. - **Where can I see the machines in action?** DCT operates technology centers in Europe, Asia, and the USA for live demonstrations and customer testing. ## Contact & Logistics - **Headquarters:** DCT Czech s.r.o., Havlíčkova 18, 680 01 Boskovice, Czech Republic. - **Global Support:** info@dct.cleaning - **Website:** https://dct.cleaning