In the highly demanding landscape of modern Surface Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA), the continuous push for component miniaturization leaves absolutely no margin for error. As high-density interconnects become the global standard, low stand-off components such as Quad Flat No-leads (QFNs), Ball Grid Arrays (BGAs), and 01005 passives create microscopic capillary barriers. During the reflow process, active flux residues, synthetic activators, and solder paste by-products easily become trapped beneath these advanced components.
If these complex flux matrices are not completely and safely removed, the “Cost of Poor Quality” (CoPQ) becomes a devastating manufacturing reality. Uncleaned ionic residues readily absorb ambient humidity. When exposed to an electrical bias voltage during product operation, they trigger Electrochemical Migration (ECM), dendritic growth, and parasitic leakage currents. The ultimate consequences are catastrophic field failures, expensive product recalls, and irreparably damaged brand reputation—outcomes that mission-critical sectors like automotive, aerospace, military, and medical electronics simply cannot afford.
This is where DCT precision cleaning agents bridge the critical gap between manufacturing limitations and absolute operational reliability. Engineered to drastically reduce surface tension and penetrate sub-mil clearances, our advanced chemistry solubilizes hardened flux residues and rinses away without leaving detrimental white residue behind. By integrating our fluids, you ensure your assemblies consistently exceed IPC-A-610 and J-STD-001 reliability standards.
We do not merely supply industrial chemical solvents; we deliver a comprehensive, risk-free manufacturing ecosystem designed specifically to eliminate your production bottlenecks. Our strategy is built upon three uncompromising pillars:
Implementing a new chemical process impacts multiple departments across a manufacturing facility. We formulate our cleaning agents to satisfy the rigorous and often conflicting demands of Process Engineering, Financial Management, and Environmental Health & Safety.
Process Engineers bear the heavy responsibility of maintaining zero-defect first-pass yields while constantly battling issues like “yellow powder” (unreacted flux residue on machine walls) and cosmetic board defects. Our cleaning chemistries provide the ultimate technical control:
From a financial perspective, evaluating a cleaning fluid based solely on its initial price per liter is a critical error. True efficiency is measured by the Total Cost of Ownership (TCO) across the process lifecycle. DCT chemistry is specifically engineered for superior economic performance:
Modern electronic manufacturing must perfectly balance high-performance cleaning with strict adherence to environmental regulations and operator safety protocols. Our portfolio is designed with long-term sustainability at its core.
Selecting the optimal cleaning agent depends heavily on the specific contamination type, the required cycle time, and the cleaning machine technology utilized (Ultrasonic vs. Spray-in-Air). The DCT portfolio is purposefully structured into two primary high-performance product families:
The DECOTRON® line represents the industry standard for high-volume PCBA defluxing, precision stencil cleaning, misprint removal, and general maintenance (cleaning of wave solder pallets and condensation traps). These premium aqueous and microemulsion fluids are highly effective against modern no-clean, rosin-based (RO), and water-soluble (WS) fluxes. Featuring zero flash points, they are optimized for both spray-in-air and ultrasonic systems, offering an unparalleled environmental profile and maximum safety.
The PROTON® line consists of high-strength solvent-based or modified-alcohol cleaning fluids. They are engineered for highly specific industrial applications where water-free processes are mandatory or where extremely rapid drying times without a dedicated rinse stage are required. PROTON® fluids deliver exceptional solvency power, making them ideal for the removal of heavy synthetic resins, uncured Surface Mount Device (SMD) adhesives, and tough conformal coatings like acrylics, polyurethanes, and silicones.
| Product Category | Primary Use & Application | Key Feature & Unique Selling Point |
|---|---|---|
| DECOTRON® (PCBA Defluxing) | Removal of flux residues from assembled electronic boards post-reflow. | Deep capillary penetration; high flux loading capacity; prevents ECM. |
| DECOTRON® (Stencil & Misprint) | Cleaning raw solder paste from stencils, squeegees, and bare PCBs. | Rapid paste dissolution; completely safe on tension meshes and nanocoatings. |
| DECOTRON® (Maintenance) | Cleaning wave solder pallets, condensation traps, and reflow oven parts. | Aggressive on baked-on fluxes; excellent material compatibility with aluminum. |
| PROTON® (Adhesives & Coatings) | Thick-film hybrid circuits, uncured SMD adhesives, conformal coating stripping. | Targeted rapid solvency; fast evaporation; leaves absolute zero residue. |
A: We offer a unique, uncompromising ecosystem guarantee. When you implement our advanced stainless-steel cleaning machines combined with our proprietary cleaning fluids, we eliminate the risk of hardware and chemical incompatibility. We take 100% full responsibility for the mechanical functionality and zero-defect cleanliness results of your entire washing process.
A: Yes. We offer global reach combined with dedicated localized support. Through our verified and extensive network of local distributors, your manufacturing facility is guaranteed rapid on-site troubleshooting, direct process audits, and uninterrupted fluid supply directly in your region.
A: Absolutely. We bring innovation with every project. Rather than forcing an off-the-shelf product into a complex application, our R&D engineers continuously develop and adapt our cleaning formulas to tackle highly specific client challenges, such as heavy silicones, high-temperature lead-free alloys, or complex capillary gaps.
A: Our water-based formulations are engineered with an exceptionally high contaminant loading capacity. This allows the chemistry to clean effectively even when heavily loaded with dissolved flux. As a result, the operational bath life is vastly extended, chemical make-up consumption drops, and hazardous waste disposal frequencies are minimized.
A: White residues are typically metal salts or unreacted rosin components that precipitate out of solution during the rinsing phase. Our chemistry is designed to act at a molecular level, fully solubilizing and encapsulating these residues within the wash bath, preventing them from redepositing onto the board surface during the DI water rinse.
A: Yes. Material compatibility is a cornerstone of our formulation process. We incorporate specialized chemical inhibitors to ensure that sensitive materials—including anodized aluminum, delicate marking inks, specialized plastics, and brass—remain completely unaffected even during prolonged exposure in the wash cycle.
To guarantee total process reliability, our application engineering laboratory continuously tests our cleaning agents against the industry’s most widely used solder pastes, liquid fluxes, conformal coatings, and SMT adhesives. Below is a comprehensive list of specific contaminants successfully tested and removed to IPC standards using the DCT fluid ecosystem.
| No. | Manufacturer & Product Name | Contaminant Category | Effective DCT Solution |
|---|---|---|---|
| 1 | Alpha OM-338-T | Solder Paste (No-Clean) | DECOTRON® |
| 2 | Alpha OM-340 | Solder Paste (No-Clean) | DECOTRON® |
| 3 | Alpha CVP-390 | Solder Paste (Zero-Halogen) | DECOTRON® |
| 4 | Alpha WS-826 | Solder Paste (Water Soluble) | DECOTRON® |
| 5 | Kester NP505-HR | Solder Paste (No-Clean) | DECOTRON® |
| 6 | Kester NXG1 | Solder Paste (No-Clean) | DECOTRON® |
| 7 | Kester 256 / 256-A | Solder Paste (RMA) | DECOTRON® |
| 8 | Indium 8.9HF | Solder Paste (Halogen-Free) | DECOTRON® |
| 9 | Indium 10.1 | Solder Paste (Lead-Free) | DECOTRON® |
| 10 | Indium 3.2 | Solder Paste (Water Soluble) | DECOTRON® |
| 11 | Senju M705-GRN360 | Solder Paste (Lead-Free) | DECOTRON® |
| 12 | Senju M705-SHF | Solder Paste (Halogen-Free) | DECOTRON® |
| 13 | Senju Sparkle Paste | Solder Paste (Alloy) | DECOTRON® |
| 14 | AIM NC258 | Solder Paste (No-Clean) | DECOTRON® |
| 15 | AIM NC254 | Solder Paste (No-Clean) | DECOTRON® |
| 16 | AIM W20 | Solder Paste (Water Soluble) | DECOTRON® |
| 17 | Loctite GC 10 | Solder Paste (Temp Stable) | DECOTRON® |
| 18 | Loctite GC 3W | Solder Paste (Water Soluble) | DECOTRON® |
| 19 | Loctite HF 212 | Solder Paste (Halogen-Free) | DECOTRON® |
| 20 | Heraeus F640 | Solder Paste (Lead-Free) | DECOTRON® |
| 21 | Heraeus F360 | Solder Paste (No-Clean) | DECOTRON® |
| 22 | Nihon Superior SN100C | Solder Paste (Lead-Free) | DECOTRON® |
| 23 | Almit SRC-66 | Solder Paste (Lead-Free) | DECOTRON® |
| 24 | Shenmao PF606-P26 | Solder Paste (Lead-Free) | DECOTRON® |
| 25 | Kester 959T | Liquid Flux (No-Clean) | DECOTRON® |
| 26 | Kester 952-S | Liquid Flux (No-Clean) | DECOTRON® |
| 27 | Kester 979 | Liquid Flux (VOC-Free) | DECOTRON® |
| 28 | Alpha EF-8000 | Liquid Flux (Wave Solder) | DECOTRON® |
| 29 | Indium NC-771 | Liquid Flux | DECOTRON® |
| 30 | Stannol 500-6B | Liquid Flux | DECOTRON® |
| 31 | Cobar 390-RX | Liquid Flux | DECOTRON® |
| 32 | Interflux IF 2005M | Liquid Flux | DECOTRON® |
| 33 | Loctite 3621 | SMD Adhesive (Uncured) | PROTON® / DECOTRON® |
| 34 | Loctite 3609 | SMD Adhesive (Uncured) | PROTON® / DECOTRON® |
| 35 | Heraeus PD 955 | SMD Adhesive (Uncured) | PROTON® / DECOTRON® |
| 36 | Fuji Red Glue | SMD Adhesive (Uncured) | PROTON® |
| 37 | Humiseal 1B31 | Conformal Coating (Acrylic) | PROTON® |
| 38 | Humiseal 1C49 | Conformal Coating (Silicone) | PROTON® |
| 39 | Peters SL 1301 | Conformal Coating | PROTON® |
| 40 | Electrolube DCA | Conformal Coating (Modified) | PROTON® |
| 41 | Dow Corning 1-2577 | Conformal Coating (Silicone) | PROTON® |
Do not allow unverified chemistry and a lack of support to dictate your production yields and escalate your total cost of ownership. Experience the power of our 100% process responsibility guarantee on your actual printed circuit board assemblies.
Contact our application engineering team today to schedule a comprehensive process consultation, audit your current TCO, or instantly connect with your certified local distributor for immediate on-site support.
100% RESPONSIBILITY FOR THE CLEANING PROCESS
We take full responsibility for the functionality of the cleaning process.
Complete cleaning solutions
We can offer complete cleaning solutions for all existing applications.
Quality of cleaning systems
We manufacture cleaning systems exclusively in stainless steel because it has long-term advantages.
pure quality of cleaning agents
We care about the functionality of the cleaning chemistry, but also about ecology.
Technical and economic improvements
With every project, our greatest motivation is to bring the customer a better technical and economic solution.
Development and customization
By continuously developing our cleaning technologies, we are moving forward and responding to developments in the electronics industry.
Democenters Worldwide
We give customers the opportunity to actually test the cleaning solution.
Direct service Support
For us, service support does not end with the installation, it begins.
Our references show the diversity of our customers and how we have been able to
to tailor our services to their needs and expectations.





