Removing Solder Paste from Stencil, Misprints, and PCBAs
Removing Solder Paste from Stencil, Misprints, and PCBAs
WHAT IS THE CUSTOMER‘S STORY?

The customer used flammable and aggressive fluid to remove solder paste ALPHA OM-340 88-3-M1 from stencils, misprints, and PCBAs. This type of fluid was unfortunately also highly foaming. The customer’s need has been lower VOC, which would be consistent with the set limit, so in this case, we solved ecological problems, but also economical savings.

WHAT WAS TESTED?

Our R&D Team Tested Cleaning of:
Type of Solder Paste: ALPHA OM-340 88-3-M1
Types of Cleaned Components: 2 panels of soldered PCBAs, 1 panel of PCBs without components

A) Printing stencils from unsoldered ALPHA OM-340 88-3-M1 solder paste

B) Misprints of ALPHA OM-340 88-3-M1 solder paste on PCBs

C) PCBAs after soldering process with ALPHA OM-340 88-3-M1 solder paste

MISPRINTS and PCBA
STENCILS
COMPLETE CLEANING SOLUTION BY DCT

To make mounting of PCBs precise, printing stencils have to be clean! This is the reason why any production should clean printing stencils regularly.

Decotron CP381
Decotron® CP381
Water-based cleaning fluid determined to clean misprints and remove flux residues from PCBs after the soldering process. Ready-mix, intended for direct use. Intended for use in all types of DCT...
388_CRD
InJet® 388 CRD
InJet® 388 CRD is developed primarily for the removalof solder pastes and SMT adhesives from stencils, PumPrints,squeegees and misprints. The cleaning system can also be used for PCB cleaning, or...
RECOMMENDED CLEANING PROCESS
STENCILS + MISPRINTS
Cleaning:
Decotron® CP381 / 5 min / 40°C / 2,1 bar
Rinsing:
DI Water / 5 min / 30°C
Drying:
hot air / 5 min / 80°C
PCBs AFTER SOLDERING PROCESS
Cleaning:
Decotron® CP381 / 10 min / 50°C / 2,1 bar
Rinsing:
DI Water / 10 min / 30°C / 1 μS
Drying:
hot air / 5 min / 80°C
STENCILS + MISPRINTS Total process time: 18:30 min
IONIC CONTAMINATION TEST

We have performed ROSE (resistivity of solvent extract) test after cleaning with Decotron® CP381 cleaning agent in Injet® 388 CRD cleaning system.

IPC limit of ionic contamination (red line) corresponds to 1,56 μg NaCl/cm2.

Limit of ionic contamination (green line) is an option to enter your own limit – in this case the limit was not specified by the customer.

Result of measured ionic contamination (blue line) is 0,198 μg NaCl/cm2

Decotron CP381
Decotron® CP381
Water-based cleaning fluid determined to clean misprints and remove flux residues from PCBs after the soldering process. Ready-mix, intended for direct use. Intended for use in all types of DCT...
Stencil
RECOMMENDED CLEANING AGENT
Decotron CP381
Decotron® CP381
Water-based cleaning fluid determined to clean misprints and remove flux residues from PCBs after the soldering process. Ready-mix, intended for direct use. Intended for use in all types of DCT...
Water-based cleaning agent
Determined to clean misprints
Removes flux residues from PCBs after soldering process
Intended for use in all types of DCT cleaning system, mainly in high pressure Spray-In-Air cleaning systems

Decotron® CP381 for all three applications with set parameters described in this case study.

RECOMMENDED CLEANING SYSTEM
388_CRD
InJet® 388 CRD
InJet® 388 CRD is developed primarily for the removalof solder pastes and SMT adhesives from stencils, PumPrints,squeegees and misprints. The cleaning system can also be used for PCB cleaning, or...
Vertical Spray-In-Air technology
Device minimizes the shadowing effect
Maximizes the efficiency of the cleaning process
PCBAs
RESULTS OF TESTING
Success rate: 100%

The customer was satisfied with the results as we provided them with a more eco-friendly and sophisticated cleaning agent, which will lower their VOC, and which is also more economical speaking in the long term view.

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